| 龙玺精密-为您提供EVG 520晶圆键合机设备买卖+翻新全套解决方案
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| 编 号：2818 (发布时间:2025.11.17) |
 咨询此设备，请加我微信 |
| 名 称：EVG 520晶圆键合机 |
| 厂 商：EVG |
| 型 号：EVG520 |
| 年 份：2010 |
| 状 态：国外 |
EVG5206"EVG 520 Wafer Bonde
- Model: EVG 520
- Manual wafer load substrate bonder
- Capable of fusion compression bonding
- Capable of thermal compression bonding
- Capable of anodic bonding
- Ideal for R&D and pilot production applications
- High-vacuum capable bond chamber
- Auto opening of bond tool cover
- Windows based control software and operation interface
- Wafer size: up to 150mm capable
- Vacuum chuck: 6"/150mm diameter chuck
- Max Bond Force: 7 kN
- Top side heater: 550°C max. |
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| 龙玺精密-为您提供二手EVG 520晶圆键合机买卖+翻新全套解决方案，国内半导体工艺设备非标定制。龙先生18868521984(微)
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