| 龙玺精密-为您提供EVG 510晶圆键合机设备买卖+翻新全套解决方案
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| 编 号：2369 (发布时间:2025.11.17) |
 咨询此设备，请加我微信 |
| 名 称：EVG 510晶圆键合机 |
| 厂 商：EVG |
| 型 号：EVG510 |
| 年 份：2019 |
| 状 态：国外 |
EVG5108"EVG 510 Wafer Bonder
- Model: 510 Wafer Bonder - Manual wafer load substrate bonder - Capable of fusion
compression bonding - Capable of thermal compression bonding - Ideal for R&D and
pilot production applications - High-vacuum capable bond chamber - Windows based
control software and operation interface - Wafer size: up to 8”/200mm capable - Max
Bond Force: 10 kN - Top side heater: 550°C max. in 1°C steps - Bottom side heater:
550°C max. in 1°C steps - Temperature uniformity: ± 1,5 %Tu |
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| 龙玺精密-为您提供二手EVG 510晶圆键合机买卖+翻新全套解决方案，国内半导体工艺设备非标定制。龙先生18868521984(微)
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