CSM3002HDBU: eWLB, Tool Condition: Down, 12"&13"Wafer, 2Port, Dual Robot arm(U arm), Green Laser, 200x200 square Marking AREA(MM), Aligner Accuracy +-30um, +/-30UM, +/-0/03deg, With OCR Wafer ID Reader, Wafer Warpage 4mm, Win XP, Wafer mapping Wide Beam and dual |